MediaTek has announced its latest mid-range chipset. The new product is called Dimensity 6300 and is the successor to last year’s Dimensity 6100+.
The two Cortex-A76 cores in the chipset CPU now run at 2.4 GHz instead of 2.2. The remaining six energy-efficient Cortex-A55 cores run at 2.0 GHz. Dimensity 6300 is manufactured using TSMC’s 6 nm manufacturing process. The role of the graphics accelerator is played by the Mali G-57 MC2 GPU. According to the manufacturer, the new chip promises a 10% increase in CPU performance compared to the soon-to-be-released 6100+.
The new chipset supports MediaTek’s UltraSave 3.0+ technology, which is designed to promote energy saving, and is also equipped with an integrated 5G modem that complies with the 3GPP Release 16 standard. The MediaTek Dimensity 6300 supports the same LPDDR4X RAM and UFS 2.2 memory and storage as its predecessor, and can drive screens with resolutions up to 2520 x 1080.
The chipset supports primary cameras of up to 108 megapixels, the dual-band Wi-Fi 5 standard, and Bluetooth 5.2 connections. Realme C65 5G will reportedly be the first smartphone to pack Dimensity 6300 inside. The mobile can be launched sometime towards the end of April.
Source: GSMArena
Follow too NapiDroid.hu-ta for the latest Android news!
