Qualcomm comes with a new ARMv9 system chip


Snapdragon 7 Gen 3 can be the basis of new premium smartphones.

Qualcomm has announced its latest premium-level system chip with a heavy focus on AI. The following table details the parameters of the chip arriving in the new, ultra-mobile solutions:

Qualcomm 7 series ARMv9, new Snapdragon system chip
Type Snapdragon 7 Gen 3
Modem integrated (LTE/5G – X63)
Processor architecture ARMv9
Heterogeneous design DynamIQ
number of CPU cores,
clock and type
1 x 2.63 GHz Cortex-A715
3 pieces, 2.4 GHz Cortex-A715
4 pieces, 1.8 GHz Cortex-A510
IGP type new generation Adreno
Memory bus 2×16 bits
Supported memory LPDDR5 (3200 MHz)
HEVC coprocessor yes (decoding/encoding, 10 bit HDR)
DSP and NPU type new generation Hexagon
Triple ISP 200 / 3 x 21 megapixels (new generation Spectra)
Production technology 4 sq m (TSMC)


Compared to its predecessors, the Snapdragon 7 Gen 3 offers progress mainly in terms of the IGP and the Hexagon sub-unit for accelerating AI tasks. The company will begin shipping the new system chip later this year.

The article is in Hungarian

Tags: Qualcomm ARMv9 system chip


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