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Snapdragon 7 Gen 3 can be the basis of new premium smartphones.
Qualcomm has announced its latest premium-level system chip with a heavy focus on AI. The following table details the parameters of the chip arriving in the new, ultra-mobile solutions:
| Type | Snapdragon 7 Gen 3 |
|---|---|
| Modem | integrated (LTE/5G – X63) |
| Processor architecture | ARMv9 |
| Heterogeneous design | DynamIQ |
| number of CPU cores, clock and type | 1 x 2.63 GHz Cortex-A715 3 pieces, 2.4 GHz Cortex-A715 4 pieces, 1.8 GHz Cortex-A510 |
| IGP type | new generation Adreno |
| Memory bus | 2×16 bits |
| Supported memory | LPDDR5 (3200 MHz) |
| HEVC coprocessor | yes (decoding/encoding, 10 bit HDR) |
| DSP and NPU type | new generation Hexagon |
| Triple ISP | 200 / 3 x 21 megapixels (new generation Spectra) |
| Production technology | 4 sq m (TSMC) |
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Compared to its predecessors, the Snapdragon 7 Gen 3 offers progress mainly in terms of the IGP and the Hexagon sub-unit for accelerating AI tasks. The company will begin shipping the new system chip later this year.
